Discover this user friendly and compact system for thermoplastic molding! The Sublym is a great alternative to PDMS-soft lithography for microfluidic devices. It will dramatically ease your work when fabricating microfluidic chips: Sublym simplifies the quick prototyping and production of microfluidic/microsystem chips with just a simple button press.
General
The Sublym is a rapid and user-friendly alternative to PDMS soft lithography for creating Microfluidic Devices. It is a hot embossing machine, using heat and pressure to mold a variety of materials in a matter of minutes, including Flexdym, COC, PMMA and PS. The sublym is only powered by electricity and do not require any pump allowing for adaptable installation in different locations.
Features & Benefits
Sublym is:
- Easy-to-use: do not require extensive training
- Ultra-compact: 33 x 34 x 11 cm3
- Fast molding: 2 min to 15 min
- Electrical plug & play
- Adjustable temperature: from 50 °C up to 180 °C
- Suitable for mold up to 4-inch
- Low Cost
Applications:
- Soft thermoplastic molding
- Microfabrication
- Microfluidic fabrication
Working principle
The temperature inside the molding chamber is controlled within the range of 50°C to 180°C. The molding pressure is applied through a deformable membrane under vacuum (0.6 bar under ATM) allowing to apply a force between 1.2 kN to 1.8 kN.
Process cycle
Sublym is tailored for Flexdym molding, but other thermoplastics can also undergo the same process. With just a push of a button, you can have your molded material ready in few minutes.
Storage and handling
The equipment heats up during operation, so it is crucial to wear heat-resistant gloves at all times. Avoid transporting products while they are plugged in or still hot. Store the products in a standard room environment and in a suitable box.
Content
1x Sublym Compact Soft Embossing Machine
1x Power supply
Specifications
Working features
| Preheat mode |
0 - 120 s / 50 °C - 180 °C |
| Normal mode (under vacuum) |
1 - 999 s / 50 °C - 180 °C |
| Memory mode |
Save settings in two memory modes |
| Spacing |
Adjustable manually from 0.1 to 12 mm |
| Display |
Centigrade and Fahrenheit Temperatures |
| Monitoring |
Auto. process counting |
Technical specifications
| Dimension |
33 x 34 x 11 cm3 |
| Molding size |
Up to 4" in diameter |
| Max Mold Thickness |
1 cm (optional: 1.5 cm) |
| Temperature |
50 °C - 180 °C |
| Temperature Ramp |
180 °C / 5 min |
| Approximative Force |
1.2 kN to 1.8 kN |
Documentation
Sublym Hot Embossing Machine user guide
References
- Lachaux et al., Lab on a Chip 2016, L2017 Jul 25;17(15):2581-2594. doi: 10.1039/c7lc00488e
- Perrault et al., Insights on Polymers for Microfluidics Applied to Biomedical Applications
- Overview of Materials for Microfluidic Applications, IntechOpen 2016
- Roy et al., Lab on a Chip 2015, Lab Chip, 2015,15, 406-416, doi:10.1039/C4LC00947A
